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From: Aparna M <a-m1@ti.com>
To: <meta-arago@lists.yoctoproject.org>, <praneeth@ti.com>, <denis@denix.org>,
<reatmon@ti.com>, <nm@ti.com>
CC: <devarsht@ti.com>, <s-adivi@ti.com>
Subject: [meta-arago][dunfell][PATCH 0/5] Add support in toplevel Makefile of
SDK
Date: Fri, 13 May 2022 13:19:18 +0530
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Add support in toplevel Makefile of SDK
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expand
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Add support in toplevel makefile of SDK for: - uboot build for am62xx-evm with DM firmware packaged with tispl.bin - fitImage.itb build required for HS devices. Cureently adding support for am64xx-hs-evm. - Combining sysfw.itb with tiboot3.bin to generate combined tiboot3.bin for k3 devices. - sysfw-image build for am62xx-evm - Rename UBOOT_MACHINE for am62xx-evm R5 Aparna M (5): ti-tisdk-makefile: Makefile_u-boot-spl: Add support for u-boot-a53 build for am62xx-evm ti-tisdk-makefile: Makefile_linux-fitimage: Add support to build fitImage.itb for am64xx-hs-evm ti-tisdk-makefile: Makefile_sysfw-image: Add support for combined tiboot3.bin build in k3 devices ti-tisdk-makefile: Makefile_sysfw-image: Add support for am62xx-evm ti-tisdk-makefile: Rename UBOOT_MACHINE for R5 for am62xx-evm .../ti-tisdk-makefile/Makefile_linux-fitimage | 32 +++++++++++++++++++ .../ti-tisdk-makefile/Makefile_sysfw-image | 21 +++++++----- .../ti-tisdk-makefile/k3/Makefile_u-boot-spl | 16 +++++++--- .../ti-tisdk-makefile_1.0.bb | 8 ++++- 4 files changed, 64 insertions(+), 13 deletions(-) create mode 100644 meta-arago-distro/recipes-tisdk/ti-tisdk-makefile/ti-tisdk-makefile/Makefile_linux-fitimage